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APG Knowledge

  • 1.What is TG

    TG is short for Glass of Transitioin,Glas transition temperature is the temperature range where a thermoseting polymer changes from a hard,rigid or glasy state to a more pliable,compliant or rubery state,insulators which are exposed to a temperature below the Tg. In APG technique,to casting APG products,like epoxy resin insulators,curent transformer,bushings,contact box,Tg test is a necesary test to check product quality.
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  • 2.Mold polishing level

    APG clamping machine with apg mold to casting epoxy resin products,APG insulator,APG bushing mold polishing level A0=Ra0.08μm A1=Ra0.016μm A3=Ra0.0322 A4=Ra0.0632 P20 mold material treatment and advantages: Hardened In order to improve the life of the mold to more than 800,000 mold times, the pre-hardened steel can be quenched and low temperature return The hard way of fire to achieve. When quenching, preheat at 500-600°C for 2-4 hours, then keep it at 850-880°C for a certain period of time (...
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  • APG technology 1

    APG technology is currently mainly used to produce medium voltage epoxy resin insulation products. The APG process can not only effectively improve production efficiency, but also has high quality and good dimensional stability. It is especially suitable for mass production of medium voltage epoxy resin insulation parts. This article briefly introduces APG technology based on artistic principles, basic characteristics and manufacturing conditions. APG technology is currently mainly used to pr...
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  • APG technology 2

    The APG process includes three processes: pre-mixing, automatic gelation under pressure, and hardening after molding. Once the metal insert is installed in the mold, the temperature of the mold is preheated to 80 to 100°C higher than the temperature of the epoxy resin mixture, that is, to 140 to 160°C. Then through the pressure system of the APG equipment, the epoxy resin mixing system in the storage tank (which has been defoamed in a vacuum) is pressed into the mold cavity through the pipe, ...
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